Turnkey EMS · Shenzhen · NPI to volume
Precision PCB assembly, from first article to full ramp.
Soldera Electronics runs twelve SMT lines across an 18,000 m² campus — placing 01005 passives and 0.35 mm-pitch BGAs to IPC-A-610 Class 3, with component-level traceability on every build.
QFN
BGA
01005
0.35 mm pitch
12
SMT lines
850K
components per hour
99.6%
first-pass yield
24 h
RFQ turnaround
ISO 9001:2015
ISO 13485:2016
IPC-A-610 Class 3
IPC J-STD-001
RoHS · REACH
Capabilities
Four services. One accountable line.
Assembly, integration and test run on the same MES under the same quality system — so a single team owns the schedule, the yield and the answer when a build window matters.
SMT Assembly
Twelve lines place 01005 passives to 74 mm BGAs at up to 85,000 CPH each, with 3D SPI after every print and nitrogen reflow on all volume lines.
01005 · 0.35 mm pitch
THT & Mixed Technology
Selective soldering, dual-wave and hand assembly to IPC J-STD-001 for the connectors, magnetics and power stages that SMT cannot carry.
Selective · dual wave
Box-Build & Systems
Enclosure integration, cable harnesses, firmware flashing, burn-in and retail-ready packout — one purchase order from bare board to boxed unit.
Firmware · burn-in
Test Engineering
In-circuit, flying probe, boundary scan and custom functional fixtures — designed in-house and correlated against your golden units.
ICT · FCT · JTAG
Line capacity
Placement capacity, quantified.
Figures are sustained production rates, audited quarterly — not launch-day peaks.
| Line type | Lines | Placement speed | Smallest package | Max board size |
|---|---|---|---|---|
| High-speed chip shooter | 4 | 85,000 CPH | 01005 | 510 × 460 mm |
| Flexible fine-pitch | 6 | 42,000 CPH | 0.35 mm pitch BGA | 680 × 480 mm |
| NPI / prototype | 2 | 28,000 CPH | 01005 | 460 × 410 mm |
Dual-lane conveyors on all volume lines · 12-zone nitrogen reflow · automated changeover in under 20 minutes.
DFM & NPI
From Gerber to golden unit in five steps.
New product introduction is a process, not a favor. Every build follows the same gated route, and you see the evidence at each gate.
01
File intake & quote
Send Gerber or ODB++ files, BOM and centroid data. A commercial quote with a component-availability report comes back within 24 hours.
02
DFM & DFT review
Process engineering flags paste, pad, panelization and test-point risks within 48 hours — before anything touches a line.
03
Prototype build
An engineer-attended first run on a dedicated NPI line. Five-day standard turn with photo documentation of every stage.
04
First article inspection
AOI, X-ray and dimensional results measured against IPC-A-610 Class 3 acceptance criteria — signed by both sides before ramp.
05
Ramp to volume
Locked BOM revision, MES-controlled routing and weekly yield reports as quantities scale from hundreds to hundreds of thousands.
Quality assurance
Inspected at every stage — not just at the end.
3D SPI & AOI
Every panel passes 3D solder-paste inspection after print and automated optical inspection after reflow — defects are caught in minutes, not lots.
X-ray & microsection
BGA, QFN and bottom-terminated parts are X-rayed for voiding and bridging; joints are microsectioned on every qualification build.
ICT & functional test
Bed-of-nails ICT, flying probe for NPI and custom functional fixtures verify every net and every feature before packout.
IPC-A-610 Class 3
IPC J-STD-001
< 150 DPPM outgoing
ANSI/ESD S20.20 floor
Sourcing & traceability
Every reel, every board, accounted for.
Counterfeit parts and gray-market stock are yield killers. Soldera buys only through franchised channels and scans every reel into the MES, so any board can be traced back to its components in seconds.
- Franchised-distributor sourcing with manufacturer CoCs on every lot
- Incoming inspection with LCR sampling and counterfeit screening
- MSD control — sealed storage, bake logs and floor-life tracking
- MES scan points record reel, operator and machine per reference designator
- Build records retained for ten years, exportable on request
Trace record — WO 58214
| Ref | Lot code | Result |
|---|---|---|
| U7 — MCU | ST-2426B | AOI + X-ray pass |
| C14–C22 | MUR-0402-104 | IQC LCR pass |
| J2 — USB-C | MOL-5566-A | Push-out test pass |
| L3 — Power | TDK-8812-F | X-ray void 4.2% |
Generated by Soldera MES · panel 07 of 42 · scanned 08:42, batch release 11:15
The plant
An 18,000 m² campus built for throughput.
12
SMT lines across two halls, dual-lane on all volume lines
480
process, test and quality specialists on staff
99.6%
first-pass yield, trailing twelve months
60+
countries served, EXW to DDP incoterms
Client outcomes
Trusted by teams who can’t miss a build window.
“Soldera took our wearable from EVT to 40,000 units a month without a single line-down day. Their NPI team flagged issues our own design review had missed.”
Maren Kold — Head of Hardware, Nordvik Devices
“The 48-hour DFM report caught a via-in-pad problem that would have cost us a full respin. That one document paid for the entire first build.”
Priya Raghavan — VP Operations, Halcyon Instruments
Request for quote
Send your BOM today. Quote back in 24 hours.
Attach Gerber or ODB++ files, a BOM with manufacturer part numbers and centroid data. A named engineer — not a portal — replies with pricing, availability and any DFM flags.
NDA on request · Turnkey, consigned or hybrid sourcing · EXW, FOB or DDP terms